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HFM-16D | Stress Tester

Eliminate PCB warping, cracking, and solder joint failure caused by stress.

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Product Introduction:

1. Small precision measuring instruments;

2. Portable, modular expansion;

3. Simple construction, controlled by computer for measurement;

4. Imported core hardware with high precision and stable performance;

5. Easy to operate, one click automatic generation of reports and batch export of reports;

6. The language supports both Chinese and English versions;

7. Simultaneously display strain values, maximum/minimum principal strains, diagonal strains, strain rates, etc.


Product parameters:

   Project   HFM-16D   HFM-24D   HFM-32D
   Number of channels   16   analog input channels   24   analog input channels   32   analog input channels
   Maximum Sample Rate   10KHZ/channel
   Sampling mode   Multi   channel high-speed synchronous sampling
   ADC resolution   24   digits
   Support strain gauge sensor resistance value   120Ω
   Support Wheatstone bridge type   1/4   bridge
   Accuracy   0.5%,   conversion accuracy: 3.5062nV/V/LSB
   Precision gain error   0.05%   (calibrated, standard measurement conditions 25 ℃, ± 5 ℃)
   Full-scale range   ±20000me
   Overvoltage protection between terminals   ±30V
   Stability   Gain   drift 10ppm/℃
   Type of chassis interface   USB   2.0 high-speed input
   Power supply   11 to   30VDC, 220VAC
   Operation temperature    -40℃~70℃,
   Working humidity   10%~90% RH, No condensation
   Storage temperature    -40℃~85℃,
   Storage humidity   5%~90% RH, No condensation
   Protection grade   IP40

Application case:

Stress Tester

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