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H.F.X-FAM80 | Non contact solder paste thickness gauge

This product is a non-contact thickness measuring equipment designed for the growth of Fine Pitch process capabilities, improvement of printing technology, and precision requirements in quality management. It can also provide various SPC statistical analysis values to enhance process capabilities.

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Product Introduction:

This product is a non-contact thickness measuring equipment designed for the growth of Fine Pitch process capabilities, improvement of printing technology, and precision requirements in quality management. It can also provide various SPC statistical analysis values to enhance process capabilities.


Functional features:

1、 Automatic/manual measurement of solder paste thickness.

2、 Manually measure the length, width, and spacing of the paste.

3、 Automatically calculate solder paste area, cross-sectional area, and volume.

4、 Measurement values can be recorded, archived, and printed.

5、 Can capture images captured by CCD and store image files.

6、 Automatically calculate process capability indicators Cp, Cpk, Cpm.

7、 Provide thickness distribution chart and X-Bar/R-BAR control chart.

8、 It can be measured and recorded separately according to different production lines simultaneously.

9、 Can measure the basic thickness and quickly adjust the focal length.

10、 Timed call sampling is available.


Product parameters:

   Project   FAM80
   Visible range   2.5mm×1.8mm
   Magnification ratio   X90
   Power supply   Computer   provided
   Dimensions   350(L)×400(W)×290(H)mm
   Weight   30Kg
   Inspection method   Laser   Vision
   Table size   350(W)×265(L)mm
   Measure thickness   0.5mm~0.007mm
   Resolution   0.003mm
   Repeatability   (±)0.0035mm
   Analysis System   FAM80
   X. Y Mobile Sliding Platform   Travel   X=200, Y=100, glass countertop X=230, Y=190 (optional)


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