MenuProduct Center

Semiconductor Oven HDX-9000 series

The semiconductor oven with nitrogen filled has strong universality, high stability and high performance. It adopts high capacity horizontal air recycling system, adopts special chamber structure and sealing technology, with excellent air tightness and temperature uniformity to meet the high performance requirements of semiconductor products. This oven is suitable for curing semiconductor wafers, IC packages (copper substrate, silver gel, silica gel, epoxy resin), glass substrate and other products.

inquire

  • Product Description
  • FAQ
  • Our Company
  • Global Services
  • Video

Features:

1. High capacity horizontal air recirculation hot air system

2. The chamber is fully sealed design, adopts stainless steel plate, with good air tightness, saving nitrogen

3. The upper and lower box can run independently with different process parameters to meet the production of different products

4. The heating rate is controllable, and the cooling system assists the cooling, which can effectively improve the production efficiency

5. High precision temperature controller, the control accuracy can reach to 0.5℃

6. Test by Class 1000 clean room, it can meet the semiconductor dust-free workshop and product requirements

7. Low oxygen content control, real-time monitoring, the oxygen content can be controlled within 100PPM


Semiconductor oven

Semiconductor oven

Semiconductor oven

Semiconductor oven


Product parameters:

   Model No.   HDX-9000
   Heating system
   Box   dimension   L700*W550*H(600*2)mm
   Number   of boxes and working mode   Two boxes,   each box can run independently
   Hot   air system   Hot air   circulation system with adjustable wind speed and volume
   Cooling   system   Water   cooling circulation system, according to customer workshop cooling water
   Nitrogen   system   With flow   meter and oxygen analyzer to display oxygen content in real-time
   Internal   specification   Equipped   with 4 stainless steel support shelves, with adjustable spacing between   shelves
   Cooling system
   Temperature   operating range   Room   temperature+10℃~250℃
   Temperature   control mode   PID   closed-loop control+SSR drive
   Control   system   PC+PLC   electrical control system, Windows operating interface
   Temperature   accuracy   ±0.5℃
   Temperature   uniformity   ±2%℃(no-   load)
   Heating   rate   ≥5℃/min
   Cooling   rate   2-5℃/min
   Heating   power   10KW*2
   Oxygen   content control   ≤500PPM(Option:≤100PPM)
   Working   voltage   AC3Ø    5W  380V50/60HZ
   Total   power   21KW
   MES   communication protocol   Standard
   Cleanliness   class   Class 1000
   Conveyor system
   Dimension(LxWxH)   L1700*W1200*H1800mm
   Weight   500-800kg
   Color   Bright   wrinkled white
      Remark:Support to customize the nitrogen or vacuum   oven


Related products

Contact Us