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Snap Curing Oven

The snap curing oven adopts modular design and combines different functions, like automatic temperature control, nitrogen protection, buffer cooling, automatic loading and unloading and so forth. Through the specific temperature control, atmosphere control and automatic operation, it can complete the process after Die Attach equipment, which is mainly used in curing and bonding of semi-conductor packaging.

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Quick curing oven product features:

Heating system: equipped with six temperature zones, each temperature zone can be set separately, and the lead frame is arranged in a single row 

matrix for baking.

Transmission system: Split type independent conveying system, fully automatic control, equipped with connecting buffer section and automatic 

material receiving mechanism.

Control system: PC+PLC electrical control system, Windows operating interface, free online switching between Chinese and English, LCD display, 

supports remote monitoring.

Protection system: The device is equipped with multiple protection mechanisms, including over temperature protection, three color lights, buzzer 

fault alarms, and software interface prompts for faults.

Nitrogen system: equipped with a flow meter that can adjust the flow rate and monitor the amount of nitrogen used.


Functional features:

Each product only needs to be calibrated once, and the engineering parameters can be directly adjusted for operation during the next production, 

making the operation simple and fast;

The highest baking temperature can reach 250 degrees, which can meet the temperature requirements of various products; The temperature deviation 

of each heating module is within ± 5 ° C;

Multiple anti error alarm processing, software prompts, real-time observation of each alarm status;

Online temperature curve, allowing for real-time observation of the temperature of each temperature module;

Real time display of gas flow and pressure software for easy data tracking.


Semiconductor oven

Semiconductor oven

Semiconductor oven

Semiconductor oven

Semiconductor oven

Semiconductor oven

Semiconductor oven

Semiconductor oven


Product parameters:

   Model No.   HDX-8000
   Box part
   Lead frame size   L:125mm~300mm;W:25mm~100mm;T:0.12mm~1mm
   Magazine size   L:130mm~308mm;W:30mm~110mm;H:100mm~180mm
   Lead frame type   single row/matrix
   Number of curing zones   6(Optional)
   Temperature setting range   50℃~250℃
   Temperature uniformity   士5℃
   Temperature controller   PID intelligent temperature control,SSR output control
   Curing time   Set according to process requirements (The time can be set)
   Nitrogen system   With N2 flowmeter interface,the nitrogen flow is adjustable.
   Safety device   Overtemperature alarm device,earth leakage circuit breaker,overheat  protection
   Exhaust system   Independent interface with exhaust device
   Nitrogen consumption   ≤100L/min
   Compressed air and flow   4-7bar,90L/min
   Power supply   3 Phase 380V AC50/60Hz
   Startup power    Approx.3.3KW


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